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diener electronic | Plasma-Surface-Technology

Plasma Plasma systems Surface-Technology

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	[ 플라즈마 기술의 용어 ]

	다음은 플라즈마 기술에서 사용되는 중요한 용어를 설명하는 용어집입니다. 참고: 찾으려는 용어를 검색하려면, 브라우저의 검색 기능(Ctrl + F를 동시에 누름)을 사용하여 해당 페이지에서 검색어를 검색하거나, 간단히 원하는 검색어 철자의 첫 문자를 클릭하여 원하는 용어를 검색할 수 있습니다.

Index

1 13,56 MHz,

2 2,45 GHz, 27,12 MHz,

4 40 kHz,

A ABS 아크릴로니트릴-부타디엔-스티렌 - ABS, Acid 산, Acrylic, Activation, Active species, Adhesion, Adhesion promoters, Adhesive Strength 점착 강도, Adsorption, AFM, Aluminium, Aluminium Oxide, Anisotropic, Anode, Antiadhesive layers, Applications, Arc, Areas of application, Argon (Ar), Auger effect, Automotive engineering,

B Barrel reactor, Barreling 배럴링, Barrier layers, Base Material for Printed Circuit Boards 인쇄회로기판의 모재, BGA, Bias voltage, Binding energy, Bonding,

C Case hardening, Cathode, Chamber, Charge-exchange collision, Chemical etching, Chemisorption, Chromium, Circuit board 회로기판, Cleaning 세정, Cleaning aluminium, Cleaning copper, Coating, Coating adhesion, Coating thickness 코팅 두께, coil coating, Components of plasma systems, Contact angle, Copper, Corona discharge, Corrosion, Corrosion Protection 부식 방지, Cratering, Cross-cut tape test, CVD,

D Degreasing, Desmear process, Desorption, Direct current source / alternating voltage source, DLC layers, Downstream reactor, Duplex surface engineering,

E Easy-to-Clean-coatings 간편 세정 코팅, Electrode, Electron, Electron volt, Electronegative plasma, Electropositive plasma, Epilam coats, Epitaxy, Epoxy Resins 에폭시 수지, ESCA, Etching, Etching mask, Etching of glass, Etching of PCBs, Ethylene-Propylene-(Diene)-Copolymer - EP(D)M 에틸렌-프로필렌-(디엔)-공중합체 - EP(D)M ,

F Finish, Flame cleaning 화염 세정, Flame Plasma Treatment 화염 플라즈마 처리, Fluorescent tube, Fluxing agent, Foil treatment, Funktionalization,

G Gallium Arsenide, Gas discharge, GDOS, Generator, Glass, Glow,

H Hard coatings, HMDSO, Hydrogen 수소, Hydrophilic layers, Hydrophilicity, Hydrophobic, Hydrophobic layers,

I IC, Impregnation 침윤, Induction, Inductive plasma, Industrial pretreatment, interfacial tension, Ion, Ion Beam Etching 이온 빔 식각, Ion implantation, Ion measuring sensor, Ion plating, Ionization, Isotope, Isotropic,

L Langmuir probe, LCP 액정 중합체 - LCP, Lead frame, LIGA process, Lightning discharge, Lithography, Low pressure plasma 저압 플라즈마,

M Magazine, Magnetic mirror, Magnetron, Mask, Mean free path length 평균자유경로 길이 , MEMS, Metal, MFC / Mass-Flow-Controller, Microsandblasting, Microwave technology 극초단파 기술, Modification 개질 ,

N Nanoparticles 나노입자, Neon light tube 네온 라이트 튜브, Neutron 중성자, Non neutral plasmas 비중성 플라즈마 , Nucleon 핵자,

O OAUGDP, Optical coating 광학 코팅, Overetching 과잉 식각, Oxygen 산소,

P PACVD, Painting, Painting of plastics, Parallel plate reactor 평행판 반응기, Passivating Layer 부동화층, PCB, Peeling 박리, Permeation 투과 , Photon 광자, Photoresist 포토레지스트, Physical etching 물리적 식각 , Physisorption 물리흡착, Pirani sensor 피라니 센서, Plasma 플라즈마, Plasma asher 플라즈마 애셔, Plasma boriding 플라즈마 침붕, Plasma carbonitriding 플라즈마 침탄질화, Plasma carburising, Plasma chemistry 플라즈마 화학작용, Plasma cleaner 플라즈마 클리너, Plasma colour, Plasma diffusion 플라즈마 확산, Plasma etcher 플라즈마 식각기, Plasma etching 플라즈마 식각, Plasma hardening 플라즈마 경화, Plasma nitriding, Plasma nitrocarburising 플라즈마 침질탄화, Plasma polymerisation 플라즈마 중합반응, Plasma spray coating 플라즈마 용사, Plasma technology 플라즈마 기술, Plasmaasher 플라즈마애셔, Plasmacleaner 플라즈마클리너, Plasmaetcher 플라즈마식각기, Plastic, Plastic coating, Polyacrylonitrile - PAN 폴리아크릴로니트릴 - PAN, Polyamide - PA 폴리아미드 (PA), Polyamide Thermoplastic Elastomer – PA-TPE 폴리아미드 열가소성 엘라스토머 – PA-TPE, Polybutene - PB 폴리부텐 - PB, Polybutylene Terephthalat (PBT) 폴리부틸렌 테레프탈레이트 (PBT), Polycarbonate 폴리카보네이트 (PC) , Polyethylene - PE 폴리에틸렌 - PE, Polyethylene PE (폴리에틸렌), Polyethylene terephthalat (PET) 폴리에틸렌 테레프탈레이트 (PET), Polymerization 중합반응, Polymethacrylimide - PMI 폴리메타크릴이미드 - PMI, Polymethyl Methacrylate - PMMA 폴리메틸 메타크릴레이트 - PMMA, Polyolefins 폴리올레핀, Polyoxymethylen 폴리옥시메틸렌 (POM), Polypropylene 폴리프로필렌 (PP), Polystyrene 폴리스티렌 (PS), Polytetrafluourethylene 폴리테트라풀루오르에틸렌 (PTFE), Positive column 양광주, PPS 폴리페닐렌 설파이드 - PPS, Preparation before sticking, Pretreatment 전처리 , Principle of plasma process 플라즈마 공정의 원리, Printed circuit board, Printing Process 인쇄 공정, Process gas 공정 가스, Proton 양자, PUR PU 경질 폼, PUR PU 연질 폼, PVC, PVF 폴리비닐플루오라이드 - PVF,

R Reactive ion plating 반응성 이온 플레이팅 (RIP), Recipient 용기, Release agents 이형제, Release agents residues 이형제 잔류물 , RIE, Roots pump 루츠 펌프, Rotary drum, Rotary vane pump,

S SEM, Sheath, Silicon 규소, Silicon carbide 탄화 규소, Silicon dioxide 이산화 규소, Silicon nitride 질화 규소, Silicone 실리콘, Silver 은, SIMS, Small flanges, Soldering, Sputtering 스퍼터링, Stainless steel, Sticking, Sticking in automotive engineering, Sticking of glass, Sticking PE PE 부착, Sulfur hexaflouride 육불화황, Surface energy 표면 에너지, Surface oxide 표면 산화물, Surface radical 표면 래디컬, Surface technology 표면 기술,

T Tensides 테슬라, Tesla 계면활성제, Test ink 테스트 잉크, Tetrafluoromethane 테트라플루오로메탄, Thornton diagram 쏜튼 다이어그램, Titanium carbide 탄화 티타늄, Titanium nitride 질화 티타늄, TOF-SIMS, Trench, Turbomolecular pump 터보 분자 펌프,

U Ultraviolet 자외선, UV radiation UV 방사 ,

V Vapour Deposition,

W Wet Method 습식법, Wetting, Wetting Test 습윤 시험,

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